摘要 |
<p>A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern. There is provided a process for producing a patterned film, comprising the steps of preparing a photosensitive resin composition that upon light irradiation, generates an acid or a base and is hardened; coating substrate (2) with the photosensitive resin composition to thereby form photosensitive resin composition layer (1) of given thickness; and exposing the photosensitive resin composition layer (1) selectively through mask (3) to light so as to travel at least portion of the photosensitive resin composition at unexposed regions toward the exposed regions and further effect hardening thereof, thereby obtaining patterned film (1A) furnished on its surface with protrusion/depression pattern.</p> |
申请人 |
SEKISUI CHEMICAL CO., LTD.;FUKUI, HIROJI;AOKI, KENICHI;ICHIMURA, KUNIHIRO;SUEZAKI, MINORU;ENAMI, TOSHIO;ISHIZAWA, HIDEAKI;UNATE, TAKAO;KOBAYASHI, HIROSHI |
发明人 |
FUKUI, HIROJI;AOKI, KENICHI;ICHIMURA, KUNIHIRO;SUEZAKI, MINORU;ENAMI, TOSHIO;ISHIZAWA, HIDEAKI;UNATE, TAKAO;KOBAYASHI, HIROSHI |