发明名称 EMBEDDED CAPACITORS AND METHODS FOR THEIR FABRICATION AND CONNECTION
摘要 Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymer layer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
申请公布号 WO2007075714(A3) 申请公布日期 2007.12.21
申请号 WO2006US48472 申请日期 2006.12.19
申请人 MOTOROLA, INC.;KEMET ELECTRONICS CORPORATION;DUNN, GREGORY J.,;CHELINI, REMY J.,;CROSWELL, ROBERT T.,;LESSNER, PHILIP M.,;PREVALLET, MICHAEL D.,;PRYMAK, JOHN D., 发明人 DUNN, GREGORY J.,;CHELINI, REMY J.,;CROSWELL, ROBERT T.,;LESSNER, PHILIP M.,;PREVALLET, MICHAEL D.,;PRYMAK, JOHN D.,
分类号 H01G9/00 主分类号 H01G9/00
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