POSITIVE PHOTOSENSITIVE RESIN COMPOSITION CONTAINING POLYMER HAVING RING STRUCTURE

摘要

[PROBLEMS] To provide a positive photosensitive resin composition which has high sensitivity and is reduced in film thickness reduction in unexposed areas and which, after film formation, retains a high transmission and a film thickness even through high-temperature burning or treatment with a liquid resist stripper and does not crack during ITO sputtering; and a cured film suitable for use as a film material for various displays. [MEANS FOR SOLVING PROBLEMS] The positive photosensitive resin composition comprises: ingredient (A) which is an alkali-soluble acrylic polymer having at least one of carboxy and phenolic hydroxy and at least one of hydroxy other than phenolic hydroxy and amino having active hydrogen and having a number-average molecular weight of 2,000-30,000; ingredient (B) which is an alkali-soluble resin having a ring structure in the backbone; ingredient (C) which is a compound having a vinyl ether group; ingredient (D) which is a compound having a blocked isocyanate group; ingredient (E) which is a photo-acid generator; and a solvent (F). The cured film is obtained from the composition.