| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology prominently increasing adhesion of a fluorine resin substrate with a non-roughened metal foil by a simpler method and capable of forming fine pitch circuits. SOLUTION: A resin composition for adhering a fluorine resin substrate, characterized by comprising 2-20 pts.wt polymer component soluble in a solvent and having one or more of hydroxy, carboxy and amino in a molecule as a functional group, and≥50 pts.wt epoxy resin compound comprising an epoxy resin having≥200°C boiling point and an amine-based epoxy resin curing agent having≥200°C boiling point, is used as the resin composition for forming an adhesive layer for adhering a metal foil on a fluorine resin substrate. And, an adhesive for fluorine resin substrate and using the resin composition, a metal foil 4 with an adhesive layer in which a metal foil 2 and an adhesive layer 3 form a laminate structure, a copper-clad laminate using the fluorine resin substrate and a method for producing the laminate, are provided. COPYRIGHT: (C)2008,JPO&INPIT
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