发明名称 |
PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING |
摘要 |
A method of forming a filled via with an optically transmissive material and a resulting product. The method comprises drilling a via in a panel and filling the via with an optically transmissive material. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.
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申请公布号 |
US2007291496(A1) |
申请公布日期 |
2007.12.20 |
申请号 |
US20070742862 |
申请日期 |
2007.05.01 |
申请人 |
ELECTRO SCIENTIFIC INDUSTRIES, INC. |
发明人 |
NASHNER MICHAEL S.;HOWERTON JEFFREY |
分类号 |
G02B6/10;F21V17/00 |
主分类号 |
G02B6/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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