| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrostatic chuck device for attracting a substrate, such as wafer etc, and an exposure device, where a release time of the substrate attracted by an electrostatic chuck can be made much shorter than usual. <P>SOLUTION: The electrostatic chuck device is equipped with an electrostatic chuck provided with an attracting plane provided to its chuck main body, a steam supply means which is used for supplying steam to the attracting plane of the electrostatic chuck, and furthermore a steam exhausting means which is used for exhausting the steam supplied to the attracting plane by the steam supply means. <P>COPYRIGHT: (C)2008,JPO&INPIT |
