| 摘要 |
PROBLEM TO BE SOLVED: To secure high reliability by preventing open failure of a gate balance resistor from occurring when operating a semiconductor device. SOLUTION: A first insulating substrate 1 is formed on a heat sink 6, and a semiconductor device 2 is formed thereon. An insulating resin case 8 is provided so as to cover the first insulating substrate 1 and the semiconductor device 2. The second insulating substrate 3 is spaced apart from the first insulating substrate 1, and is attached inside the insulating resin case 8. On the second insulating substrate 3, a resistive element 4 functioning as a gate balancing resistance is fixed with soldering. Thus, the second insulating substrate 3 with the resistive element 4 mounted thereon is made to be spaced apart from the first insulating substrate 1 with the semiconductor device 2 mounted thereon and is attached to the insulating resin case 8 side. The configuration, when operating the semiconductor device 2, prevents the heat generated in the semiconductor device 2 from causing heat conduction to the resistive element 4, thereby controlling solder peeling of the resistive element 4. COPYRIGHT: (C)2008,JPO&INPIT
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