发明名称 ADHESION PROMOTOR, CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a new adhesion promotor, a curable organopolysiloxane composition having excellent adhesion durability to a base material such as an organic resin, and forming a cured product having high reflective index and high light transmittance, and a semiconductor device having excellent reliability. <P>SOLUTION: The adhesion promotor is represented by the average formula: R<SP>1</SP><SB>a</SB>SiO<SB>(4-a)/2</SB>[R<SP>1</SP>is a group selected from the group consisting of a 1-10C substituted or nonsubstituted alkyl group, a 2-20C alkenyl group, a 6-20C aryl group, a 1-10C alkoxy group and an epoxy group-containing organic group, with the proviso that the contents of the alkenyl group, the aryl group, the alkoxy group and the epoxy group-containing organic group are at least 5 mol% respectively based on the whole R<SP>1</SP>; and (a) is a number satisfying the relation of 1.0&le;(a)&le;4.0]. The curable organopolysiloxane composition contains the compound, and the semiconductor device is obtained by using the composition. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007327019(A) 申请公布日期 2007.12.20
申请号 JP20060182000 申请日期 2006.06.30
申请人 DOW CORNING TORAY CO LTD 发明人 MORITA YOSHIJI;KATO TOMOKO;UEKI HIROSHI;TANAKA OSAMU
分类号 C08G77/20;C08L83/05;C08L83/06;C08L83/07;H01L23/29;H01L23/31;H01L33/56;H01L33/62 主分类号 C08G77/20
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