| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which gives a good pattern profile, excels in focal depth, and is used for liquid immersion lithography by which irradiation with a radiation is carried out through a liquid for liquid immersion lithography having a higher refractive index than air at a wavelength of 193 nm, and in which materials elute in a small amount into the liquid for liquid immersion lithography such as water with which the composition contacts in liquid immersion lithography. <P>SOLUTION: The radiation-sensitive resin composition is used for a resist pattern forming method including liquid immersion lithography by which irradiation with a radiation is carried out through a liquid for liquid immersion lithography between a lens and a photoresist film, and contains a resin (A) and at least one radiation-sensitive acid generator (B) represented by formulae (1) and (2), wherein R<SP>1</SP>is H; R<SP>2</SP>is alkoxyl; X is butylene; and each R<SP>4</SP>and R<SP>5</SP>are fluoroalkyl. <P>COPYRIGHT: (C)2008,JPO&INPIT |
