发明名称 WIRING BOARD WITH BUILT-IN PART, AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board with built-in part wherein the reliability of a wiring board is hard to be degraded even if solder for connecting a built-in part is remelted. <P>SOLUTION: The wiring board with built-in part is provided with a first insulation layer, a second insulation layer which is located like lamination to the first insulation layer, an electric/electronic part embedded in the second insulation layer, a wiring pattern which is pinched with the first and second insulation layers and includes a land for mounting the electric/electronic part, and a connection which connects the terminal of the electric/electronic part and the land for mounting and is provided with a cured resin and a melted solder mixed in the resin. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007329213(A) 申请公布日期 2007.12.20
申请号 JP20060157988 申请日期 2006.06.07
申请人 DAINIPPON PRINTING CO LTD 发明人 SASAOKA KENJI
分类号 H05K3/46;H01L23/12;H05K1/18;H05K3/34 主分类号 H05K3/46
代理机构 代理人
主权项
地址