发明名称 Method for producing heat sink and heat sink thus produced
摘要 In a heat sink for semiconductor elements and the like, a pipe made of a heat-conductive material such as copper, aluminum and the like is bent at a middle portion thereof and wound such that a forward flow passage and a return flow passage for a liquid coolant are both formed into a spiral shape with the bent portion held at the center of the spiral.
申请公布号 US4747450(A) 申请公布日期 1988.05.31
申请号 US19860908773 申请日期 1986.09.18
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 IKEGAME, HIROO;NONAKA, SHIGEO;ITO, TAKURO;MATSUMOTO, TOSHIAKI
分类号 H01L23/473;(IPC1-7):F28F3/12 主分类号 H01L23/473
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