发明名称 CUTTING METHOD AND DEVICE OF STENCIL BASE PAPER IN STENCIL PRINTING MACHINE AND STENCIL BASE PAPER FOR STENCIL PRINTING MACHINE
摘要 PROBLEM TO BE SOLVED: To provide the cutting method and device of a stencil base paper in a stencil printing machine, in which no driving part for moving a cutting tool such as a cutter, a heater or the like is necessary, which can be composed by a simple structure, in addition, which raises cutting accuracy and makes the cleaning of smelting dregs or the like unnecessary due to the non-contact cutting of a master. SOLUTION: This cutting device 17 of a master M in the stencil printing machine is to cut the master M having a length for a plurality of form plates widthwise at an interval of the length for one form plate by a method wherein, in the cutting device 17, a colored line L is provided at the cutting site of the master M by a lining device 31 so as to irradiate the line L with a flash by a flash irradiating means 32 in order to melt/cut the master M at the position of the line L. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007326247(A) 申请公布日期 2007.12.20
申请号 JP20060157451 申请日期 2006.06.06
申请人 DUPLO SEIKO CORP 发明人 OKAGAITO YASUNARI
分类号 B41L13/14;B41J2/01 主分类号 B41L13/14
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