| 摘要 |
A semiconductor chip according to the present invention is a semiconductor chip having a circuit forming region, in which an internal circuit including a function element is formed, on the middle portion of the surface thereof, and having the surface thereof opposed to and joined to the surface of a solid-state device. The semiconductor chips includes: a plurality of bumps, formed so as to be ridged on the surface and brought into contact with the surface of the solid-state device, for electrically connecting the internal circuit with the solid-state device; power source wiring, formed in the surrounding region of the circuit forming region, to which power source voltage is supplied; ground wiring, formed in the surrounding region of the circuit forming region, which is grounded to ground potential; and protection elements, formed between the power source wiring and the ground wiring, which electrically intervenes between the bumps and the power source wiring and between the bumps and the ground wiring, respectively.
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