| 摘要 |
A laser diode packaging and a fabricating method thereof are provided to increase the distance between an electrode pad and the laser diode chip to prevent the damage of a laser diode chip by capillaries during wire bonding. A laser diode packaging includes a stem(100), a laser diode sub-mount(103), a photo diode sub-mount(105), a laser diode chip(104), and a monitoring photo diode chip(106). The stem has leads(101a,101b,101c) attached thereon. The laser diode sub-mount and the photo diode sub-mount are attached on the stem, and have chip mounting surfaces of chip crossed with each other. The monitoring photo diode chip is bonded on the photo diode sub-mount to detect the light emitted from the laser diode chip. The monitoring photo diode chip has a light receiving unit(106b), and an electrode pad(106a) adjacent to the light receiving unit and wire-bonded on the lead. The distance between the electrode pad of the monitoring photo diode chip and the laser diode chip increases by tilting the monitoring diode chip with respect to the photo diode sub-mount. |
