| 摘要 |
<P>PROBLEM TO BE SOLVED: To significantly improve the reliability and long-term stability of a light-emitting device comprising a semiconductor light-emitting element sealed with resin, and to mount a plurality of chips in a compact fashion. <P>SOLUTION: This light-emitting device is equipped with a primary lead, a secondary lead, a resin portion where at least part of the primary lead and part of the secondary lead are embedded, a primary semiconductor light-emitting element mounted in the primary lead, a semiconductor element mounted in the secondary lead, a primary wire connecting the primary semiconductor light-emitting element and the secondary lead, a secondary wire connecting the semiconductor element and the primary lead, and silicone resin of JISA hardness of 50 degrees and over that covers the primary light-emitting element and the semiconductor element. A primary cut-off portion is arranged between the mounting portion of the primary semiconductor light-emitting element and the connecting portion of the secondary wire in the primary lead. A secondary cut-off portion is arranged between the mounting portion of the semiconductor element and the connecting portion of the primary wire in the secondary lead. <P>COPYRIGHT: (C)2008,JPO&INPIT |
