发明名称 APPARATUS AND METHOD OF THERMOCOMPRESSION BONDING
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and an method of thermocompression bonding which can efficiently cool a pressing surface of a thermocompression bonding tool. SOLUTION: A flow guiding plate 30 is arranged on the lower part of the thermocompression bonding tool 2, and a compressed air is supplied from an air source 24 to a ventilating hole 2b opened on the pressing surface 2a provided on the lower part of the thermocompression tool 2. With this configuration, the air flown out from the ventilating hole 2b is guided along the pressing surface 2a (refer to an arrow A) and contacts the pressing surface 2a heated by a heater 5. In this way, the pressing surface 2a can be efficiently cooled, and a cooling time can be shortened. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007329305(A) 申请公布日期 2007.12.20
申请号 JP20060159449 申请日期 2006.06.08
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKANISHI TOMOAKI
分类号 H01L21/60 主分类号 H01L21/60
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