| 摘要 |
PROBLEM TO BE SOLVED: To enhance arranging position precision (mounting accuracy) for a sensor chip with respect to a flat face of a chip holding member, in a rotary sensor device with the sensor chip adhesion-fixed onto the flat face of the chip holding member. SOLUTION: The sensor chip 25 is fixed by an adhesive onto the flat face 20a of the chip holding member 20. Grooves 50a-50d are formed on the flat face 20a of the chip holding member 20, and step differences 51a-51d are formed by the grooves 50a-50d. The step differences 51a-51d are formed point-symmetrically with respect to the center of an arranging area of the chip sensor 25, in an edge of an adhesive arranging area wider than an under face of the sensor chip 25. COPYRIGHT: (C)2008,JPO&INPIT
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