| 摘要 |
<p>In an electronic component built-in substrate of the present invention, an electronic component (41, 42, 43) is mounted on a mounted body (5) having a first wiring layer (12), the electronic component (41, 42, 43) is embedded in an insulating layer (25), a conductive ball (30) is arranged to pass through the insulating layer (25) and connected electrically to the first wiring layer (12), a second wiring layer (14) connected electrically to the conductive ball (30) is formed on the insulating layer (25), and the first wiring layer (12) and the second wiring layer (14) are interlayer-connected via the conductive ball (30).</p> |
