Multilayer build-up wiring board

摘要

The invention relates to a multilayer build-up wiring board obtained by alternately providing interlayer resin insulating layers 50 and conductor layers on at least one side of a core substrate. A plurality of plain layers are formed as said conductor layers, a plurality of mesh holes 35a, 59a are formed in each of said plurality of plain layers and the mesh holes 35a, 59a are formed in the pair of plain layers placed upper side and lower side of the interlayer resin insulating layer 50 so that part of the mesh holes 35a, 59a overlay on one another (Fig. 6).