| 摘要 |
An apparatus for manufacturing semiconductor devices having a roughly rectangular parallelepiped box-shape includes an internal insertion space for semiconductor packages, first guide grooves and arranged along the longitudinal direction in both side surfaces facing the insertion space and second guide grooves and arranged parallel to the first guide grooves and respectively. Edge portions of an upper semiconductor package (a semiconductor component) are loosely fitted into the second guide grooves so that the movement of the upper semiconductor package in the left and right direction is restricted. Further, edge portions of a lower semiconductor package (a substrate for mounting semiconductor components) are loosely fitted into the first guide grooves so that the movement of the lower semiconductor package in the left and right direction is restricted. By using the apparatus, it becomes possible to provide a semiconductor device in which poor connections are difficult to occur, and further to provide an apparatus for manufacturing semiconductor devices and a method of manufacturing semiconductor devices that enable to prevent the occurrence of such poor connections in the obtained semiconductor devices and also enable to reduce manufacturing costs. |
