| 摘要 |
A thin film encapsulation structure for an organic device, an electronic component, and a method for manufacturing the same are provided to improve sealing, and to maintain high light emission in the range of visible light and simple process control. A thin film encapsulation structure includes a primary inorganic barrier layer(5), a planarization layer(6), and a secondary barrier layer(14). The primary inorganic barrier layer is arranged on an organic electronic device or a surface of the device directly. The planarization layer is arranged on the primary inorganic barrier layer. Thickness of the planarization layer is larger than a simple value of distance between a highest peak and a deepest valley of the surface of the primary barrier layer, the encapsulated surface or the surface of the device under the primary barrier layer. The secondary barrier layer is arranged on the planarization layer. |
