发明名称 |
Deposition fabrication using inkjet technology |
摘要 |
A method of fabricating a circuit lead, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of substantially uniformly patterned micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and (b) drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a circuit lead. The invention also includes an electronic circuit comprising: (a) a substrate including a plurality of micropores that are substantially uniformly patterned; (b) a microchip; and (c) a circuit lead in electrical communication with the microchip and contacting the substrate, the circuit lead comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.
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申请公布号 |
US7309020(B2) |
申请公布日期 |
2007.12.18 |
申请号 |
US20060397107 |
申请日期 |
2006.04.04 |
申请人 |
LEXMARK INTERNATIONAL, INC. |
发明人 |
ANDERSON FRANK E.;GUAN YIMIN |
分类号 |
G06K19/06;B41M5/00;B44C1/17;G01N33/00;G03G7/00;H01B1/00;H01B1/12 |
主分类号 |
G06K19/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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