PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board and a manufacturing method thereof are provided to improve the conductivity between substrates by forming a plating layer on the surface of a paste bump. A method for manufacturing a printed circuit board includes the steps of: forming a paste bump by selectively printing a conductive paste on a substrate(S10); forming a plating layer on the surface of the paste bump(S20); and stacking an insulating material on the substrate to make the paste bump penetrate the insulating material(S30). An inner layer circuit is formed on the surface of the substrate. The first step includes the step of printing the conductive paste to be elastically connected to the inner layer circuit.