MOLDING MATERIAL, MOLDING AND RFID SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a molding material, a molding and an RFID system which ensure communication range and the operation of RF tags and are static-resistant.

SOLUTION: The dicing frame 10 for semiconductor wafers to which the RF tag 2 of the RFID system 1 is attached is molded from a molding material composed of a thermoplastic resin mixed with at least a conductive material. The molding material is so selected that the time for attenuation from a charge voltage of 5 KV as provided in FTMS 101B Method 4046-1969 to 500 V is ≤5 seconds and the surface resistivity of the dicing frame 10 is 1. E+10 to 5. E+12 Ω.

COPYRIGHT: (C)2008,JPO&INPIT