METHOD FOR DEPOSITING SOLDER MATERIAL ON AN ELECTRONIC COMPONENT PART

摘要

A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part (4) of an electronic component to be bonded by reflow of solder material to another part into a reliable, void-free connection during a subsequent assembly step comprises the following steps. Minute particles (3) of solder material whose cumulative volume corresponds to the total volume to be deposited are loaded into a cavity (2) cut into a fixture (1) made from a material such as graphite. The cavity delineates the specific area of deposit. The part (4) is then laid upon the fixture and immobilized thereon by a cover (7) made from a material such as graphite. The fixture and its enclosed part are then subjected to solder material melting temperature under a controlled atmosphere in a furnace.