SEMICONDUCTOR DEVICE PACKAGING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device packaging structure capable of taking out an once sealed semiconductor element from a circuit board easily. SOLUTION: The semiconductor device packaging structure includes a semiconductor device with a first connecting electrode, and a circuit substrate having the 2nd connecting electrode unit, while the first connecting electrode unit and the 2nd connecting electrode unit are put opposite and a semiconductor element is mounted on the circuit board. A gap between the semiconductor element and a circuit board is filled with cured body of resin composition. The resin composition includes a resin component and insulating filler. A coefficient of thermal expansionαupperon the side of semiconductor device of the cured body is different from a coefficient of thermal expansionαloweron the side of circuit substrate of cured body, at one of temperatures of 90-250°in the semiconductor device packaging structure. COPYRIGHT: (C)2008,JPO&INPIT