| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallic foil with an adhesive layer capable of satisfactorily reducing a transmission loss in a high frequency band, showing excellent heat resistance, and enabling manufacture of a printed wiring board hardly causing a separation between layers. SOLUTION: In the preferred embodiment the metallic foil with the adhesive layer includes the metallic foil 10 and the adhesive layer 20 formed on the M surface 12 of the metallic foil 10. The adhesive layer 20 comprises a curable resin composition containing a component (A) of a poly-functional epoxy resin, a component (B) of a poly-functional phenolic resin and a component (C) of a polyamideimide. The weight average molecular weight of the component (C) is from not less than 50,000 to not more than 250,000. COPYRIGHT: (C)2008,JPO&INPIT |
