| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot melt adhesive using ethylene-(meth)acrylate copolymer as a base resin, having reduced stringiness and excellent in thermal stability. SOLUTION: The hot melt adhesive comprises (A) the ethylene-(meth)acrylate copolymer, (B) a tackifier resin, (C) a wax, (D) an antioxidant, and compounded with (E) a polyethylene with melt flow rate of 1-100 produced by a moderate- or low-pressure method. COPYRIGHT: (C)2008,JPO&INPIT
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