| 摘要 |
<p>A buildup board, and an electronic component and an apparatus including the same are provided to improve a transmission characteristic simply with respect to a conventional method. A buildup board includes a plurality of buildup layers(150a,150b) stacked on both sides of a core layer(140). At least one of the core layer and the buildup layers has a multi-layered structure. The multi-layered structure includes a signal wiring pattern, a pad(152b) connected to the signal wiring pattern, an insulation part(156) arranged around the pad at the same layers as the pad, and a conductor(154) arranged around the insulation unit at the same layers. A keep out is different from at least two place of the multi-layered structure, wherein the keep out is defined by a minimum interval between a contour of the pad among the same layers and the conductor nearest to the pad.</p> |
