发明名称 |
HIGHLY EFFICIENT BOTH-SIDE-COOLED DISCRETE POWER PACKAGE, ESPECIALLY BASIC ELEMENT FOR INOVATIVE POWER MODULES |
摘要 |
<p>Two DBC wafers have patterned first conductive surfaces which receive a semiconductor die in sandwich fashion. Lead frame terminally extending into the package interior and are connected to the die terminals. The outer conductive surfaces of each of the wafers are available for two-sided cooling of the semiconductor.</p> |
申请公布号 |
WO2007139852(A2) |
申请公布日期 |
2007.12.06 |
申请号 |
WO2007US12328 |
申请日期 |
2007.05.23 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION;HAUENSTEIN, HENNING M. |
发明人 |
HAUENSTEIN, HENNING M. |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|