发明名称 PROCESSING METHOD FOR SEMICONDUCTOR LAMINATE, AND MANUFACTURING METHOD OF NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To achieve mass-production of a semiconductor laminate provided with a p-type nitride-based semiconductor layer having a low resistance and excellent uniformity of in-plane resistivity, particularly to achieve mass-production of a nitride-based semiconductor light emitting element. <P>SOLUTION: In the method for processing a semiconductor laminate, the processing with liquid is conducted under the temperature condition of 50&deg;C or higher but lower than 400&deg;C to the semiconductor laminate formed through growth of a plurality of nitride-based semiconductor layers on a substrate. Moreover, the semiconductor laminate is subjected to the processing with the liquid and the method for manufacturing nitride-based semiconductor light emitting element also includes a step of the processing with the liquid. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007317726(A) 申请公布日期 2007.12.06
申请号 JP20060142990 申请日期 2006.05.23
申请人 SHARP CORP 发明人 AIOI AKIO;OGAWA ATSUSHI
分类号 H01L21/205;H01L21/304;H01L33/06;H01L33/32;H01L33/60;H01L33/62;H01S5/343 主分类号 H01L21/205
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