| 摘要 |
<p>Provided is a mounting structure of a flip-chip bonded semiconductor device and the like. In the electronic component mounting structure, bonding reliability is not deteriorated even when a die is increased in sizes, with less warping. The electronic component mounting structure is provided with the electronic component having a substrate and the square-shaped electronic component mounted on the substrate. A gap between the substrate and the electronic component is filled with a first resin hardened material applied at least at a corner section of the electronic component, and a second resin hardened material applied at least on a center portion of the electronic component. The flexural modulus of the first resin hardened material is larger than that of the second resin hardened material.</p> |
