| 摘要 |
A method for repairing a conductive structure of a circuit board is proposed. The method is implemented by performing a micro-depositing process or a micro-plating process on a surface of at least a contact pad of a circuit board without having a conductive structure formed thereon through micro-droplet or micro-electrode technique, thereby forming a conductive structure on the surface of the at least one left-out contact pad of the circuit board. As a result, the fabrication yield is increased, and extra time and costs spent on reworking the circuit board can be avoided as compared with the prior art.
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