发明名称 |
A BONDING TOOL AND METHOD |
摘要 |
A bonding tool and method A bonding tool and method for bonding together layers of a MEMS transducer device, including at least one layer of a piezoelectric material, and an intermediate reinforcing layer of titanium, or other metal, comprising: positioning the layers above one another and spaced apart by means of spacing members, heating said layers to a bonding temperature, and retracting the spacing members so as to bring the layers together under pressure to effect a bond between adjacent surfaces of the layers, wherein a press head is employed with a compliant caul for evenly distributing the press force; and permitting said layers to cool to an operating temperature in which said piezoelectric layer is under compressive strain and the titanium layer is under tensile strain. |
申请公布号 |
WO2007138346(A1) |
申请公布日期 |
2007.12.06 |
申请号 |
WO2007GB50289 |
申请日期 |
2007.05.23 |
申请人 |
BAE SYSTEMS PLC;HUCKER, MARTYN JOHN;WARSOP, CLYDE |
发明人 |
HUCKER, MARTYN JOHN;WARSOP, CLYDE |
分类号 |
H01L41/083;B32B37/14;B32B38/18;B81C3/00;H01L41/313;H01L41/39 |
主分类号 |
H01L41/083 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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