| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder alloy capable of effectively preventing the corrosion of a solder flow tank and achieving a lead-free state in a packaging process without additional equipment investment. SOLUTION: The lead-free solder alloy has a composition consisting of 0.1-3% Cu, 0.001-1% Ag, 0.001-0.05% Fe by weight and the balance Sn. COPYRIGHT: (C)2008,JPO&INPIT
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