| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive free of the problem of organic solvent vaporization, and capable of expressing predetermined physical properties including adhesive strength, thermal stability and solvent resistance, to provide a laminated form using the adhesive, and to provide a method for producing the laminated form. <P>SOLUTION: The adhesive is such that, in a moisture-curable hot-melt composition containing, as a moisture-involved reaction-curable component, a prepolymer made from a polyol compound and a polyisocyanate compound, the above component completes moisture-involved reaction at 70% or greater. This adhesive is solid at room temperature. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
