| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent moldability without separating a resin component and an inorganic filler when prepreg obtained by filling an epoxy resin with the inorganic filler is hot-pressed and molded and good stability of a varnish or the prepreg and to provide the epoxy resin prepreg, a metal-clad laminate and a printed wiring board using the resin composition. SOLUTION: The epoxy resin composition comprises the resin component containing the epoxy resin and a curing accelerator and the inorganic filler. Furthermore, the epoxy resin composition in which the curing accelerator is an imidazole compound represented by general formula (1) (wherein, R<SB>1</SB>to R<SB>4</SB>may each be same or different and represent each a hydrogen atom, a 1-20C alkyl group or a phenyl group; and R<SB>5</SB>represents a 1-20C alkylene group) is used. COPYRIGHT: (C)2008,JPO&INPIT |
