WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring substrate wherein a conductor wire can be bonded rigidly to the wiring substrate even if width of conductor wire is reduced.

SOLUTION: The wiring substrate includes an insulating base material 2, a bonding layer 3 formed on the surface of the insulating base material, a conductor wire 4 formed on the surface of the bonding layer, and a bump electrode 5 formed extending in a region on the bonding layers in both sides of the conductor wire crossing the longitudinal direction of the conductor wire. The backside of the conductor wire in the region where the projected electrode is formed on the surface, the rear surface of the region formed on the bonding layer in both sides of the conductor wire in the bump electrode and a part of the side surface sink toward the internal side from the surface of the bonding layer, and are bonded to the bonding layer.

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