| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding device by which a wafer can be held by aligning the center of the wafer with the center of a chuck table for holding the wafer. SOLUTION: The grinding device is provided with the chuck table which holds the wafer, a grinding means which grinds the wafer held by the chuck table, and a wafer carry-in means which carries the wafer to the chuck table. It is provided with a center aligning means which aligns the center of the wafer carried by the wafer carry-in means. The center aligning means is provided with a holding table mechanism provided with a holding table which holds the wafer and is rotatably constructed, and a table position detecting means for detecting the turning position of the holding table; an imaging means which takes an image of a peripheral region of the wafer held by the holding table; a displacement detecting means which detects the amount of displacement between the center of rotation of the holding table and the center of the semiconductor wafer, and the maximum displaced position on the basis of image information taken by the imaging means; and a correction means which corrects the amount of displacement between the center of rotation of the holding table and the center of the semiconductor wafer detected by the displacement detecting means. COPYRIGHT: (C)2008,JPO&INPIT
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