| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which can quickly decrease the number of particles emerging after maintenance, and has high operating ratio. SOLUTION: The ALD apparatus is provided with a supply nozzle for film formation and a supply nozzle for precoating separately. The supply nozzle for film formation is a distribution type where gas is supplied mainly to a semiconductor substrate, and the supply nozzle for precoating is an L-shaped type where gas can be also supplied to the lower part of a reaction chamber. Thus, a precoat film can be formed on the lower part of the reaction chamber by less number of cycles, which has a characteristic enough to prevent particles from emerging. COPYRIGHT: (C)2008,JPO&INPIT
|
