发明名称 |
Self-assembled mono-layer liner for cu/porous low-k interconnections |
摘要 |
An interconnect structure of an integrated circuit includes a low-k dielectric layer over a semiconductor substrate, a conductor in the low-k dielectric layer, and a dielectric transition layer between the low-k dielectric layer and the conductor, wherein the dielectric transition layer has a thickness of less than about 50 Å.
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申请公布号 |
US2007278682(A1) |
申请公布日期 |
2007.12.06 |
申请号 |
US20060509498 |
申请日期 |
2006.08.24 |
申请人 |
KO CHUNG-CHI;CHOU CHIA-CHENG;LIN KENG-CHU;BAO TIEN-I;YU CHEN-HUA |
发明人 |
KO CHUNG-CHI;CHOU CHIA-CHENG;LIN KENG-CHU;BAO TIEN-I;YU CHEN-HUA |
分类号 |
H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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