Semiconductor device manufacturing method, involves providing semiconductor substrate available with surface, and layer pile comprising conductive layer on substrate surface

摘要

The method involves providing a semiconductor substrate available with a surface, and a layer pile comprising a conductive layer on the substrate surface. The layer pile is structured so that individual conductive strips and individual land-contact surfaces (111) are formed. Each land-contact surface is connected with a corresponding conductive strip. Lithographic exposure is done using a set of two different photomasks for structuring of layer pile. The land-contact surfaces are arranged at a side of an arrangement area which has multiple conductive strips. Independent claims are also included for the following: (1) a set of photomasks (2) a semiconductor device, which has a semiconductor substrate.