发明名称 PCB AND METHOD OF MANUFACTURING THEREOF
摘要 <p>A PCB and a manufacturing method thereof are provided to enhance a heat-radiating effect by interposing a heat-radiating coating layer between an insulating layer and a heat-radiating layer to make smooth the heat transfer between the insulating layer and the heat-radiating layer. A PCB includes a heat-radiating layer(20), a pair of insulating layers(10), a predetermined circuit pattern(12), an interlayer conduction unit, and a heat-radiating coating layer(30). The pair of insulating layers are laminated with interposing the heat-radiating layer therebetween. The predetermined circuit pattern is formed on the insulating layer. The interlayer conduction unit electrically connects the upper and the lower parts of the insulating layer by passing through the insulating layer. The heat-radiating coating layers are formed on both sides of the heat-radiating layer respectively, and has a DLC(Diamond Like Carbon).</p>
申请公布号 KR100781584(B1) 申请公布日期 2007.12.05
申请号 KR20060055844 申请日期 2006.06.21
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, EUNG SUEK;YANG, DEK GIN;KIM, KEUN HO
分类号 H05K1/02;H05K7/20 主分类号 H05K1/02
代理机构 代理人
主权项
地址