METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

A method for manufacturing a circuit board is provided to reduce the whole thickness of a substrate by embedding a circuit pattern on the substrate and transferring a thin insulation layer on the substrate. A method for manufacturing a circuit board includes the steps of: forming a first circuit pattern on an insulation layer of a carrier on which the insulation layer and a first seed layer are sequentially stacked(S100); stacking one side of the carrier having the first circuit pattern to face an insulation substrate and compressing the carrier and the insulation substrate(S200); removing the carrier to transfer the first circuit pattern and the insulation layer on the insulation substrate(S300); and forming a second circuit pattern on the insulation layer transferred on the insulation substrate(S400).