Semiconductor module with a semiconductor sensor and a plastic package and its method of fabrication.

摘要

Semiconductor module (5) has a semiconductor sensor chip (1) with a housing (2). The sensor chip has a sensor area (3) and an insensitive area (7). The sensor area is formed by cutting a funnel (12) in an opaque embedding plastic mass (8) by laser ablation. The insensitive sensor area is covered by the embedding plastic. An independent claim is made for a method of manufacture of a semiconductor sensor module with a sensor chip and a sensor housing.