METHOD OF PROCESSING THE ULTRA-THIN PRINTED CIRCUIT BOARD

摘要

A method of half-etching a copper foil for a thin film PCB is provided to prevent damage of the thin film PCB in a conveyor process by implementing thick copper regions at an edge of the thin film PCB. A copper foil formed on an insulation layer is etched partially using a half-etching. A PCB(Printed Circuit Board) protection area(20) is defined at an edge of the PCB. The defined PCB protection area is masked and then the rest exposed area except for the defined PCB protection area is etched. Then, a thin copper foil is formed in the rest exposed area by the half-etching while preserving the defined PCB protection area.