Semiconductor package for e.g. adjustment and testing apparatus, has metallic grid with auxiliary pins that project outside of encapsulation block by sides of block, where auxiliary pins carry out adjusting and testing operations of chip

摘要

The package (1) has an encapsulation block (2), in which an integrated circuit chip is embedded. A metallic grid (4) has operational pins (7) for the electric connection of the chip, where the pins project outside of the block by two opposite sides (10, 11) of the block and are connected to a printed circuit board. The grid has auxiliary pins (15) projecting outside of the block by opposed sides (12, 13) of the block, where the auxiliary pins are not connected to the circuit board and carry out adjusting and testing operations of chip. An independent claim is also included for a method for manufacturing a semiconductor package.