发明名称 HEAT RADIATING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a heat radiating structure which is flexible and has high efficiency for various kinds and large number of heat-generating components mounted on a printed wiring board. SOLUTION: Heat radiating fins 40 are automatically mounted and soldered on the printed wiring board 10 similarly to general-purpose electronic components, thereby mounting them on various positions. One or more heat radiating fins 40 are mounted on the surface of the printed wiring board opposite to mounting positions of electronic components with respect to the positions on the printed wiring board 10 mounted with heat-generating component 20, 21 and 22. By doing this, high efficient heat radiation can be realized for the various kinds and the large number of heat-generating components at a low cost without requiring many man hours for attaching. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007311381(A) 申请公布日期 2007.11.29
申请号 JP20060136052 申请日期 2006.05.16
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MASUDA KOZO
分类号 H05K7/20;H05K1/02 主分类号 H05K7/20
代理机构 代理人
主权项
地址