| 发明名称 |
LÖTELEMENT FÜR GEDRUCKTE LEITERPLATTEN |
| 摘要 |
This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal. <IMAGE> |
| 申请公布号 |
DE69838586(D1) |
申请公布日期 |
2007.11.29 |
| 申请号 |
DE1998638586 |
申请日期 |
1998.06.02 |
| 申请人 |
IBIDEN CO. LTD. |
发明人 |
TSUKADA, KIYOTAKA;KOBAYASHI, HIROYUKI;UKAI, YOSHIKAZU;CHIHARA, KENJI;TOHYAMA, YOSHIHIDE;OKUDA, YASUYOSHI;KODERA, YOSHIHIRO |
| 分类号 |
H05K3/34;B23K35/00;B23K35/26;H01L23/498;H05K3/24 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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