发明名称 APPARATUS AND METHOD FOR MANUFACTURING THIN FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To suppress the inclination of a contact surface of a ground electrode without increasing the plate thickness of a wall, even if distortion occurs on the wall due to a difference in pressure between the outside and a film-forming vacuum chamber. <P>SOLUTION: The communication hole of a fixed body 31 that is formed at the distorted center of a wall 15 due to a difference in pressure between a film-forming vacuum chamber 13 and the outside is concentrically positioned at the through-hole of the wall 15, and a supporting body 33 is driven along a rail 34 engaged with a guide 32 that includes two pairs of opposing reference surfaces vertical to the flat face of the fixed body 31. Thus, a flexible substrate 1 is stuck to the end face of a frame 54 while expanding and contracting an elastic body 35, forming a film forming chamber 5. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007311417(A) 申请公布日期 2007.11.29
申请号 JP20060136742 申请日期 2006.05.16
申请人 FUJI ELECTRIC HOLDINGS CO LTD 发明人 SHIMIZU HITOSHI;TANAKA YASUHITO
分类号 H01L31/04;C23C16/54;H01L21/31 主分类号 H01L31/04
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